Faster speed is always the demand by end users for PC and servers. But central processing unit (CPU) and related memory have been failing to meet the need. The main problem rests in the fact that read/ write latency has reached its limits, DRAM-based memory has come to the end of its development and SRAM products cannot satisfy the need because of their limited capacity and higher costs. Against this backdrop, a family of XRAMTM products that we are developing perfectly targets the problem. Our products outperform the current DRAM products in terms of better performance with low read/ write latency, which is similar to Level 3 Cache.
With the combination of TLC DRAM and RF DRAM patented technology, XRAM products offer the highest density on a single die, SRAM regular interface, and low latency on memory access. All these features can allow XRAM products to be used in different contexts in an age of big data, such data storage, computing and cloud-based applications. In addition, it can save 40% array power less than what DRAM products do in the same conditions. In a word, XRAM can be satisfactorily used in dual In-line memory module (DIMM), solid state drives (SSD), graphic memory, PC and servers, delivering faster speed, higher efficiency for the performance of a whole system.
Artificial intelligence (AI) is undoubtedly playing a dominant role in a smart life and a smart world. It has been increasingly applied in a large range of applications, such as self-driving, robotics, industrial automation and public safety etc. The computing speed and capability are the main factors which have influenced on the AI system performance. The current traditional main processors and some specific ASIC memory products are much faster than ever before in terms of computing capability. However, the cache responding speed becomes the bottleneck of the system performance improvement.
XRAM products can precisely break the bottleneck due to their faster processing speed. Contrast to DRAM and SRAM, XRAM can offer 10ns access time and Gigabit density, whereas the best processing result of current DRAM is at 40ns-50ns and lower density and higher cost remain the problems of SRAM. With the adoption of TLC DRAM technology, XRAM provides much higher memory density or much smaller die size, making our products much suitable for various contexts of use. Therefore, XRAM is definitely a more ideal product for AI because of its faster operating speed and higher density.
Stability, high reliability and real-time particularly have become much more significant factors for IMA application. As the economy is developing, people’s demands have been increasing. Their cave for big data, cloud computing and personalized needs is driving the firmware to be upgraded and improved. Accordingly, the operating system needs to be faster in speed and more efficient in operation. From the perspective of firmware design, such a demand can be met when the improvement of main processor and memory is achieved.
As regards the memory to be applied in the IMA scenarios, achieving real-time results means a demand for faster access time. XRAM can provide 10ns access time, closer to the performance of the 3rd level Cache. In addition, XRAM offers higher density in Gigabit and much smaller die size, all of which make XRAM the best ideal alternative for IMA. For example, in the scenario of automatic vehicles, a better access time of memory will influence not only on the user experience but also on customers’ safety. The 10ns read & write time that XRAM memory products offer can help the system have enough time to make judgement and take corresponding actions in an emergency so as to ensure users’ safety.
Communications has been demanding for high speed and wide bandwidth. Nowadays, our daily life is filled with unprecedented amount of data. A faster way of processing this data is demanding for a better performance of main processors and memory chips. XRAM memory products have faster access time and can take place of DDR3/4 in the communications applications. Take high-end routers for example, under the same circumstances, XRAM can deliver better results in latency time than DRAM and RLDRAM memory products which are common in communications system. Our products, at the same time, can offer higher density than SRAM. All these advantages of XRAM ensure the overall system to operate in a faster and more efficient way. Besides, XRAM products, based on the adoption of RFDRAM technology, can help relieve system developers’ burdens of considering how to solve the problem of read/ refresh conflict when they use DRAM memory products. As such, the firmware design will be simplified to some extent. All in all, XRAM provides a better alternative for communications system.