XingMem Technology Corporation is dedicated to scientific research and development (R&D) of new memory. Our main office is in Harbin with another in Shenzhen as its subsidiary. We have established an R&D center in the Silicon Valley of the United States. We are developing cutting-edge technologies to provide the electronic industry around the world with a new generation of products that is of higher performance, higher density, lower power and lower cost.
XingMem will offer the industry products and services that adopt the world-leading technologies we are developing. Our technologies are fully patented in various countries and sponsored by national authority. As XingMem is growing, we are powered by our research teams who are passionate for technology, professional and experienced in memory development.
XingMem is committed to commercializing and industrializing new-typed memories so as to motivate domestic industry to tackle problems in fundamental technology and focus on related scientific research. In the end, the front-end design of national memory will be revolutionized and brought into further development.
Honesty, Integrity, Agility, Cooperation, Win-win Results
Based on innovation, XingMem is committed to the industrialization of new typed memory and will make contributions to its motherland and beyond in integrated circuit technologies.
Shenzhen XingMem Technology CorporationAddress: Room 1101A, Guoren Building, Keji Middle 3rd Road, Nanshan District, Shenzhen, P.R. China 518057
Harbin XingMem Technology CorporationAddress: No. 16 Building, Chuangxin Road 1616, Songbei District, Harbin, Heilongjiang, P.R. China