XingMem Technology Corporation, established in 2015, is a high-tech company committed to memory development. There are two offices in Harbin and Shenzhen respectively and a R&D center in the Silicon Valley of the United States. The advanced technologies that we introduce into DRAM sector can offer the world’s electronic industry a new generation of memory products which are of better performance and higher density.
Led by Mr. Bo Liu, founder and CEO of XingMem, we have two main inventions: three-level-cell and refresh-free. With these technologies, we aim to provide our global customers with relevant products and services. To protect our products and technologies, we have applied for patents and received recognitions in many countries and regions. As XingMem is moving forward, we are building ourselves on a strong and dynamic team made up of experienced engineers who have brought in a total of over 20-year working experience in the design of memory and system solutions.
XingMem is intended to offer self-refresh memory products with low latency and higher performance by focusing on our XRAM development.
XingMem aims to apply its new technologies to production and commercial markets so as to boost the value of memory industry.
XingMem will base itself on the needs of customers by providing services that will help our customers shorten the period of product development, enhance performance of memory systems and reduce costs of electronic component procurement.
Honesty, Integrity, Agility, Cooperation, Win-win Results
Based on innovation, XingMem is committed to the industrialization of new typed memory and will make contributions to its motherland and beyond in integrated circuit technologies.
Shenzhen XingMem Technology CorporationAddress: Room 1101, Guoren Building, Keji Middle 3rd Road, Nanshan District, Shenzhen, P.R. China 518057
Harbin XingMem Technology CorporationAddress: No. 16 Building, Chuangxin Road 1616, Songbei District, Harbin, Heilongjiang, P.R. China